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Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Features
Low profile: 8.2 mm x 22.6 mm x 47.8 mm (0.323 in. x 0.89 in. x 1.88 in.) Wide input voltage range: 36 Vdc to 75 Vdc Input-to-output isolation: 1500 V Operating case temperature range: -40 C to +105 C Overcurrent protection, unlimited duration Positive remote on/off logic Output voltage adjustment: 90% to 110% of VO, nom Output overvoltage protection Undervoltage lockout

The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules use advanced, surface-mount technology and deliver high-quality, compact, dc-dc conversion at an economical price.

UL* 60950 Recognized, CSA C22.2 No. 60950-00 Certified, VDE 0805 (EN60950) Licensed
CE mark meets 73/23/EEC and 93/68/EEC directives Within FCC Class A radiated limits
Applications

Communications equipment Computer equipment Distributed power architectures Surface-mount applications
Options
Synchronization
Description
The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are low-profile, dc-dc converters that operate over an input voltage range of 36 Vdc to 75 Vdc and provide a precisely regulated output. The output is isolated from the input, allowing versatile polarity configurations and grounding connections. Built-in filtering for both input and output minimizes the need for external filtering. These modules are designed and manufactured to be gull-winged surface-mounted power modules that are reflowed with other surface-mount components in a typical surface-mount fashion.
* UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.)
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Input Voltage: Continuous Transient (100 ms) Operating Case Temperature (See Thermal Considerations section.) Storage Temperature I/O Isolation Voltage (for 1 minute)
* See derating curves, Figure 8, for details.
Device SMLW All All All All
Symbol VI VI, trans TC Tstg --
Min 0 0 -40 -55 --
Typ -- -- -- -- --
Max 80 100 105* 125 1500
Unit Vdc V C C Vdc
Electrical Specifications
Table 1. Input Specifications Parameter Operating Input Voltage Maximum Input Current (VI = 0 to VI, max; IO = IO, max) Inrush Transient Input Reflected-ripple Current (5 Hz to 2 0MHz; 12 H source impedance; TA = 25 C; see Figure 1 and Design Considerations section.) Input Ripple Rejection (100 Hz--120 Hz) Device SMLW SMLW All All Symbol VI II, max I2t II Min 36 -- -- -- Typ 48 -- -- 2 Max 75 0.6 0.2 -- Unit Vdc A A2s mAp-p
All
--
--
50
--
dB
Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data for further information.
2
Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Electrical Specifications (continued)
Table 2. Output Specifications Parameter Output Voltage Set Point (VI = VI, nom; IO = IO, max; TA = 25 C) Output Voltage (Over all line, load, and temperature conditions until end of life; see Figure 3.) Output Regulation: Line (VI = VI, min to VI, max) Load (IO = IO, min to IO, max) Temperature (TC = -40 C to +85 C) Output Ripple and Noise Voltage (Across one 0.1 F ceramic capacitor; see Figure 2.): RMS Peak-to-peak (5 Hz to 20 MHz) External Load Capacitance Output Current (At IO < IO, min, the modules may exceed output ripple specifications, but operation is guaranteed. For A, and G codes, the output voltage may exceed specifications when IO < IO, min.) Output Current-limit Inception (VO = 90% VO, set) Output Short-circuit Current (VO = 0.25 V at 25 C)
* For output voltages below 2.5 V, the G is trimmable down to 1.5 V.
Device Code or Suffix G* A G A
Symbol VO, set VO, set VO VO
Min 2.45 4.85 2.41 4.80
Typ 2.5 5.0 -- --
Max 2.55 5.15 2.59 5.20
Unit Vdc Vdc Vdc Vdc
A, G A, G A, G
-- -- -- -- -- --
-- -- -- -- -- --
1 0.01 10 0.1 25 0.5
-- -- -- -- -- --
mV %VO mV %VO mV %VO
A, G A, G A, G G A
-- -- -- IO IO
-- -- 0 0.15 0.10
-- -- -- -- --
25 75 220 3.0 2.0
mVrms mVp-p F A A
All All
IO IO
-- --
115 200
-- --
%IO, max %IO, max
Tyco Electronics Corp.
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SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Electrical Specifications (continued)
Table 2. Output Specifications (continued) Parameter Efficiency (VI = VI, nom; IO = IO, max; TA = 25 C; see Figure 3.) Switching Frequency Dynamic Response (IO/t = 1A/10 s; VI = VI, nom; TA = 25 C): Load Change from IO = 50% to 75% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation)
* For output voltages below 2.5 V, the G is trimmable down to 1.5 V. Engineering estimate.
Device Code or Suffix SMLW010G SMLW010A A G
Symbol -- --
Min -- -- -- --
Typ 73 79 475 350
Max -- -- -- --
Unit % % kHz kHz
All All All All
-- -- -- --
-- -- -- --
3 1.5 3 1.5
-- -- -- --
%VO, set ms %VO, set ms
Table 3. Isolation Specifications Parameter Isolation Capacitance (engineering estimate) Isolation Resistance Device All All Min -- 10 Typ 1100 -- Max -- -- Unit pF M
Table 4. General Specifications Parameter Calculated MTBF (IO = 80% of IO, max; TC = 40 C) Weight (engineering estimate) Device All All -- Min Typ 5,500,000 -- 17 (0.6) Max Unit hours g (oz.)
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Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Electrical Specifications (continued)
Table 5. Feature Specifications Parameter Remote On/Off Signal Interface (VI = VI, min to VI, max; open collector or equivalent compatible; signal referenced to VI(-) terminal. See Figure 4 and Feature Descriptions.): Logic Low--Module Off Logic High--Module On Module Specifications: On/Off Current--Logic Low On/Off Voltage: Logic Low Logic High (Ion/off = 0 mA) Open Collector Switch Specifications: Leakage Current During Logic High (Von/off = 6 V) Output Low Voltage During Logic Low (Ion/off = 1 mA) Turn-on Delay and Rise Times (at 80% of IO, max; TA = 25 C): Case 1: On/Off Input Is Set for Logic High and then Input Power Is Applied (Delay from Point at Which VI = VI, min until VO = 10% of VO, nom). Case 2: Input Power Is Applied for at Least One Second, and then the On/Off Input Is Set to Logic High (Delay from Point at Which Von/off = 0.9 V until VO = 10% of VO, nom). Output Voltage Rise Time (Time for VO to Rise from 10% of VO, nom to 90% of VO, nom) Output Voltage Overshoot (at 80% of IO, max; TA = 25 C) Output Voltage Set Point Adjustment Range Output Overvoltage Protection (clamp) Undervoltage Lockout Device Code or Suffix Symbol Min Typ Max Unit
All All All All All
Ion/off Von/off Von/off Ion/off Von/off
-- -0.7 -- -- --
-- -- -- -- --
1.0 1.2 6 50 1.2
mA V V A V
All
Tdelay
--
15
60
ms
All
Tdelay
--
4
10
ms
All All A G G A All
Trise -- Vtrim Vtrim VO, clamp VO, clamp --
-- -- 90 60 3.0 5.6 20
2 -- -- -- -- -- 27
10 5 110 110 5.7 7.7 --
ms % %VO, nom %VO, nom V V V
Tyco Electronics Corp.
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SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE VI(+)
Design Considerations
Input Source Impedance
LTEST 12 H CS 220 F IMPEDANCE < 0.1 @ 20 C, 100 kHz
BATTERY
33 F
VI(-)
The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. If the source inductance exceeds 10 H, a 33 F electrolytic capacitor (ESR < 0.7 at 100 kHz) mounted close to the power module helps ensure stability of the unit. (See Figure 1.)
8-203
Solder Recommendations
Large surface-mount components typically require a thicker stencil than smaller components to ensure a reliable solder joint. The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules have been evaluated for solder joint reliability and shock and vibration requirements using 170,000 cubic mils (2. 8mm 3) of solder. This volume can be obtained by printing solder 12 mils thick on the copper pads or overprinting the copper pads 13 mils (0.33 mm) around the pad area with 8 mils of printed solder. Although this volume is recommended, tests have been conducted using lower volumes with successful results. Contact technical support for further assistance.
Note: Input reflected-ripple current is measured with a simulated source impedance of 12 H. Capacitor Cs offsets possible battery impedance. Current is measured at the input of the module.
Figure 1. Input Reflected-Ripple Test Setup
COPPER STRIP VO (+) 0.1 F VO (-) SCOPE RESISTIVE LOAD
8-513
Note: Use one 0.1 F ceramic capacitor. Scope measurement should be made using a BNC socket. Position the load between 50 mm and 75 mm (2 in. and 3 in.) from the module.
Figure 2. Peak-to-Peak Output Noise Measurement Test Setup
CONTACT AND DISTRIBUTION LOSSES VI(+) II SUPPLY VI(-) CONTACT RESISTANCE
8-204(C)
VO(+) IO LOAD
VO(-)
Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance.
[ VO(+) - VO(-) ]IO = ---------------------------------------------- x 100 % [ VI(+) - VI(-) ]II - Figure 3. Output Voltage and Efficiency Measurement Test Setup 6 Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W Remote On/Off
Positive logic remote on/off turns the module on during a logic-high voltage on the remote ON/OFF pin, and off during a logic low. To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(-) terminal (Von/off). The switch may be an open collector or equivalent (see Figure 4). A logic low is Von/off = -0.7 V to 1.2 V. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 6V. The maximum allowable leakage current of the switch at Von/off = 6 V is 50 A. The module has internal capacitance to reduce noise at the ON/OFF pin. Additional capacitance is not generally needed and may degrade the start-up characteristics of the module.
Safety Considerations
SMLW Modules
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950, CSA C22.2 No. 60950-00, and VDE 0805 (EN60950). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the module's output to be considered meeting the requirements of safety extra-low voltage (SELV), all of the following must be true:
The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VI pin and one VO pin are to be grounded or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module's output.
VI(+) VI(-)
Von/off
+
Ion/off REMOTE ON/OFF
Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 5 A normal-blow fuse in the ungrounded lead. Figure 4. Remote On/Off Implementation
8-758a
Output Voltage Adjustment
Output voltage set-point adjustment allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) or VO(-) pins. With an external resistor between the TRIM and VO(+) pins (Radj-down), the output voltage set point (VO, adj) decreases (see Figure 5). The following equation determines the required external resistor value to obtain an output voltage change from VO, nom to VO, adj: Radj-down
Feature Descriptions
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlimited duration. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output-current decrease or increase). The unit operates normally once the output current is brought back into its specified range. Tyco Electronics Corp.
( VO, adj - L )G = -------------------------------------- - H ( VO, nom - VO, adj )
where Radj-down is the resistance value connected between TRIM and VO(+), and G, H, and L are defined in the table below. 7
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Feature Descriptions (continued)
VI(+) VO(+)
Output Voltage Adjustment (continued)
TRIM VI (+) VO (+) VI(-) Radj-down VO(-) TRIM VI (-) VO(-)
8-715e
RLOAD Radj-up
RLOAD
8-715d
Figure 6. Circuit Configuration to Increase Output Voltage
Figure 5. Circuit Configuration to Decrease Output Voltage
With an external resistor connected between the TRIM and VO(-) pins (Radj-up), the output voltage set point (VO, adj) increases (see Figure 6). The following equation determines the required external resistor value to obtain an output voltage from VO, nom to VO, adj: Radj-up GL = ---------------------------------------- - H [ ( VO, adj - L ) - K ]
The SMLW010 Power Modules have a fixed currentlimit set point. Therefore, as the output voltage is adjusted down, the available output power is reduced. In addition, the minimum output current is a function of the output voltage. As the output voltage is adjusted down, the minimum required output current can increase (i.e., minimum power is constant). As the output voltage is adjusted up, the output power should be held constant (maximum load current decreases).
Output Overvoltage Protection
The output overvoltage clamp consists of control circuitry, almost entirely independent of the primary regulation loop, that monitors the voltage on the output terminals. This control loop has a higher voltage set point than the primary loop (see Feature Specifications table). In a fault condition, the overvoltage clamp ensures that the output voltage does not exceed VO, clamp, max. This provides a redundant voltage-control that reduces the risk of output overvoltage.
where Radj-up is the resistance value connected between TRIM and VO(-), and the values of G, H, K, and L are shown in the following table. G SMLx010G SMLx010A 2870 4750 H 511 2490 K 1.28 3.77 L 1.23 1.23
The combination of the output voltage adjustment and the output voltage regulation cannot exceed 110% of the nominal output voltage between the VO(+) and VO(-) terminals.
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Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Note that the view in Figure 7 is of the surface of the module. The temperature at this location should not exceed the maximum case temperature indicated on the derating curves. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table.
Feature Descriptions (continued)
Synchronization (Optional)
With external circuitry, the unit is capable of synchronization from an independent time base with a switching rate equal to the nominal switching frequency shown in the Output Specifications table. Other frequencies may be available; please consult the factory for application guidelines and/or a description of the external circuit needed to use this feature.
Heat Transfer Characteristics
Increasing airflow over the module enhances the heat transfer via convection. Figure 8 shows the maximum power that can be dissipated by the module without exceeding the maximum case temperature versus local ambient temperature (TA) for natural convection through 3.0 ms-1 (600 ft./min.). Systems in which these power modules are used typically generate natural convection airflow rates of 0.25 ms-1 (50 ft./min.) due to other heat-dissipating components in the system. Therefore, the natural convection condition represents airflow rates of approximately 0.25 ms-1 (50 ft./min.). Use of Figure 8 is shown in the following example. Example What is the minimum airflow necessary for an SMLW010A operating at VI = 48 V, an output current of 1.6 A, and a maximum ambient temperature of 86 C? Solution
Thermal Considerations
The power module operates in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. The case temperature (TC) should be measured at the position indicated in Figure 7.
24 (0.94)
11 (0.45)
SMLW010A DC-DC Power Module IN:DC 36-75V, 0.6A OUT:DC 5V, 2A
1 8-1363e
Given: VI = 48 V, IO = 1.6 A (IO, max), TA = 86 C Determine PD (Figure 9): PD = 2.1 W Determine airflow (Figure 8): v = 1 ms-1 (200 ft./min.)
Note: Dimensions are in millimeters and (inches). Pin locations are for reference only.
Figure 7. SMLW Case Temperature Measurement Location
Tyco Electronics Corp.
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SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
cross section.
25 (1.0) FACING PWB PWB
Thermal Considerations (continued)
Heat Transfer Characteristics (continued)
3.5 MAX CASE TEMPERATURE POWER DISSIPATION, PD (W) 3.0
MODULE
2.5 2.0 1.5 3.0 ms -1 (600 ft./min.) 2.0 ms -1 (400 ft./min.) 1.5 ms -1 (300 ft./min.) 1.0 ms -1 (200 ft./min.) 1.0 NATURAL CONVECTION 0.5 0.0 50 55 60 65 70 75 80 85 90 95 100 105 110
AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE
AIRFLOW
76 (3.0)
MAX AMBIENT TEMPERATURE, TA (C)
8-2793a
Figure 8. SMLW010A and SMLW010G Forced Convection Power Derating; Either Orientation
Note: Dimensions are in millimeters and (inches).
13 (0.5)
8-1126e
Figure 10. Experimental Test Setup
3.0 POWER DISSIPATION, PD (W) 2.5 2.0 1.5 1.0 0.5 0.0 0.0 VI = 75 V VI = 60 V VI = 48 V VI = 36 V
Surface-Mount Power Module Solder Reflow Recommendation
The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are constructed with SMT (surfacemount technology) components and assembly guidelines. Such large mass/low thermal resistance devices heat up slower than typical SMT components. It is recommended that the customer review data sheets in order to customize the solder reflow profile for application board assembly. It is recommended that a reflow profile must be characterized for the module on the application board assembly. The solder paste type, component, and board thermal sensitivity must be considered in order to form the desired fused solder fillet. The power module leads are plated with tin (Sn) solder to prevent corrosion and ensure good solderability. Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device lead. Sufficient time must be allocated to fuse the plating on the lead and ensure a reliable solder joint.
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8 2.0
OUTPUT CURRENT, IO (A)
8-2790
Figure 9. SMLW010A Typical Power Dissipation vs. Normalized Output Current at TA = 25 C
Module Derating
The derating curves in Figure 8 were derived by measurements obtained in an experimental apparatus shown in Figure 10. Note that the module and the printed-wiring board (PWB) that it is mounted on are both vertically oriented. The passage has a rectangular 10
Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Surface-Mount Power Module Solder Reflow Recommendation (continued)
There are several types of SMT reflow technologies currently used in the industry. These surface-mount power modules can be adequately soldered using natural convection, IR (radiant infrared), convection/IR, or forced convection technologies. The surface-mount power module solder reflow profile is established by accurately measuring the module gull-wing lead surface temperature. The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the maximum thermal profile limits as shown in Figure 11. The lead temperature during a typical reflow profile is shown in Figure 12. Failure to observe these maximum lead temperatures and duration may result in permanent damage to the power module. Relative temperatures of the module gull-wing leads vary according to many factors, including surrounding components, internal paths, and connecting paths. Typically, pin 1 is a good choice for a conservative measurement since it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These variables make it difficult to compare various types of surface-mount modules; however, the unit has been found to be more robust during temperature profiles compared with other SMT modules available in the industry.
GULL-WING LEAD C) TEMPERATURE (
230 MAX C (PEAK) 183 C 150 C 120 C 6 MINUTES MAX 90 s MAX
4 C/s MAX
TIME (s)
8-2275
Figure 11. Maximum Thermal Profile Limits
250
MELTING POINT (60/40 SOLDER)
GULL-WING LEAD TEMPERATURE ( C)
200
150
100
50
2:30
5:00 TIME (min.)
7:30
10:00
8-2274a
Figure 12. Typical Reflow Soldering Profile Tyco Electronics Corp. 11
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Packaging Information
Vacuum Formed Trays
The SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are delivered in plastic vacuum formed trays (see Figure 13) that allow automated placement of the modules via a surface-mount pick and place machine.
285 (11.22) 225 (8.86) 345 (13.58) 45 (1.78) 378 (14.89) 165 (6.50) 381 (15.00) 105 (4.14)
0.00
3 (0.11)
12 (0.47)
216 (8.50) 212 (8.33) 184 (7.25)
90 (3.55)
43 (1.70) 12 (0.48) 4 (0.16) 0.00 19 (0.75)
8-2792
Note: Dimensions are in millimeters and (inches).
848276036
137 (5.40)
Figure 13. Vacuum Formed Tray
Specifications:

Material: PVC (ESD protected) Capacity: 24 pieces/tray Weight: 90 g (3.2 oz.)
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Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Outline Diagram
Dimensions are in millimeters and (inches). See next page for pin descriptions. Tolerances: x.x 0.5 mm (0.020 in.); x.xx 0.38 mm (0.015 in.). Top View
22.6 (0.89)
1
SMLW010A DC-DC Power Module IN:DC 36-75V, 0.6A OUT:DC 5V, 2A
PIN 1 MARK 47.8 (1.88)
Side View
42.60 (1.677)
37.62 (1.481)
32.61 (1.284)
12.60 (0.496)
2.62 (0.103) 0 (0.000)
7.59 (0.299)
0.25 (0.010)
8.5 0.30 0.1 (0.335) (0.012 0.004) MAX
Bottom View
1 2 3 4 5 6
28.4 (1.12)
12
11
10
9
8
7
5.0 (0.197)
2.54 (0.100) 3.89 (0.153)
8-2791
Tyco Electronics Corp.
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SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Recommended Hole Pattern
Component-side footprint. Dimensions are in millimeters and (inches). Tolerances: x.x 0.5 mm (0.020 in.); x.xx 0.38 mm (0.015 in.). CAUTION: Care must be taken to ensure the board in the periphery of the footprint is flat.
FOOTPRINT PERIPHERY 2.8 (0.110)
29.87 (1.176) 24.28 (0.956)
PIN 1 PAD*
3.3 (0.13) 5.0 (0.197)
30.0 (1.181)
8-1507d
* The recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). See Design Considerations section.
Pin 1 2 3 4 5 6 7 8 9 10 11 12
SMLW Function VO(+) VO(-) TRIM NC NC NC NC ON/OFF SYNC (optional) NC VI(-) VI(+)
NC may be used for internal module connections and should not be connected by the customer.
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Tyco Electronics Corp.
Data Sheet January 2002
SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Ordering Information
Table 6. Device Codes Input Voltage 48 V 48 V Output Voltage 2.5 V 5V Output Current 3A 2A Output Power 7.5 W 10 W Device Code SMLW010G SMLW010A Comcode 108609744 108520396
Optional features may be ordered using the device code suffixes shown below. The feature suffixes are listed numerically in descending order. Please contact your Tyco Electronics' Account Manager or Field Application Engineer for pricing and availability. Table 7. Device Options Option Synchronization* Device Code Suffix 3
* Custom option. May not be available on all codes.
Tyco Electronics Corp.
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SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
Data Sheet January 2002
Europe, Middle-East and Africa Headquarters Tyco Electronics (UK) Ltd Tel: +44 (0) 1344 469 300, Fax: +44 (0) 1344 469 301 Central America-Latin America Headquarters Tyco Electronics Power Systems Tel: +54 11 4316 2866, Fax: +54 11 4312 9508 Asia-Pacific Headquarters Tyco Electronics Singapore Pte Ltd Tel: +65 482 0311, Fax: 65 480 9299
World Wide Headquarters Tyco Electronics Power Systems, Inc. 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 FAX: +1-888-315-5182 (Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900) www.power.tycoelectronics.com e-mail: techsupport1@tycoelectronics.com
Tyco Electronics Corporation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2001 Tyco Electronics Power Systems, Inc. (Mesquite, Texas) All International Rights Reserved. Printed in U.S.A.
January 2002 DS00-089EPS (Replaces DS99-282EPS)
Printed on Recycled Paper

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